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課程概述 |
本課程將介紹積體電路製程，涵蓋製程各階段之基礎理論與技術、設備原理與應用，並著重製程整合與前瞻性元件製程發展之配合。內容以CMOS之矽製程為主軸，並包含各種不同元件之製程探討。
內容包含:
(1) Introduction
(2) Crystal & Wafer
(3) Oxidation
(4) Diffusion
(5) Ion Implantation
(6) Epitaxy and Thin Film Deposition
(7) Etching
(8) Lithography
(9) Back-End Technology
(10) Characterization, Measurement, and Testing
(11) Silicon-Based Process Integration
(12) Packaging
(13) Technology Trend |